Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 24
End 2
DIP 24
End 1 Number of Contacts
24
End 2 Number of Contacts
24
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
47.960 OMR
9.592 OMR Each (In a Pack of 5) (ex VAT)
50.358 OMR
10.072 OMR Each (In a Pack of 5) (inc. VAT)
5
47.960 OMR
9.592 OMR Each (In a Pack of 5) (ex VAT)
50.358 OMR
10.072 OMR Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | 9.592 OMR | 47.960 OMR |
| 125 - 370 | 8.630 OMR | 43.148 OMR |
| 375 - 995 | 7.672 OMR | 38.362 OMR |
| 1000 - 1995 | 6.716 OMR | 33.578 OMR |
| 2000+ | 6.270 OMR | 31.350 OMR |
Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
TSOP 24
End 2
DIP 24
End 1 Number of Contacts
24
End 2 Number of Contacts
24
End 1 Type
TSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


