Technical Document
Specifications
Brand
WinslowPitch
1.27 mm, 7.62 mm
End 1
14 Pin Female DIP
End 2
14 Pin Male SOJ/SOP
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
DIP
End 2 Type
SOJ/SOP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Surface Mount
Body Orientation
Straight
Contact Material
Beryllium Copper
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
DIP to SOIC Sockets
Two piece Adaptics that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
16.594 OMR
16.594 OMR Each (ex VAT)
17.424 OMR
17.424 OMR Each (inc. VAT)
1
16.594 OMR
16.594 OMR Each (ex VAT)
17.424 OMR
17.424 OMR Each (inc. VAT)
1
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Please check again later.
quantity | Unit price |
---|---|
1 - 24 | 16.594 OMR |
25 - 74 | 14.944 OMR |
75 - 199 | 13.288 OMR |
200 - 399 | 11.622 OMR |
400+ | 10.906 OMR |
Technical Document
Specifications
Brand
WinslowPitch
1.27 mm, 7.62 mm
End 1
14 Pin Female DIP
End 2
14 Pin Male SOJ/SOP
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
DIP
End 2 Type
SOJ/SOP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Surface Mount
Body Orientation
Straight
Contact Material
Beryllium Copper
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
DIP to SOIC Sockets
Two piece Adaptics that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.