Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
MSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
MSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
35.228 OMR
7.046 OMR Each (In a Pack of 5) (ex VAT)
36.989 OMR
7.398 OMR Each (In a Pack of 5) (inc. VAT)
5
35.228 OMR
7.046 OMR Each (In a Pack of 5) (ex VAT)
36.989 OMR
7.398 OMR Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 120 | 7.046 OMR | 35.228 OMR |
| 125 - 370 | 6.342 OMR | 31.708 OMR |
| 375 - 995 | 5.638 OMR | 28.188 OMR |
| 1000 - 1995 | 4.934 OMR | 24.668 OMR |
| 2000+ | 4.609 OMR | 23.045 OMR |
Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
MSOP 14
End 2
DIP 14
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
MSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


