Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
10 Pin Female SOP
End 2
10 Pin Male DIP
End 1 Number of Contacts
10
End 2 Number of Contacts
10
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
18.700 OMR
3.740 OMR Each (In a Pack of 5) (ex VAT)
19.635 OMR
3.927 OMR Each (In a Pack of 5) (inc. VAT)
5
18.700 OMR
3.740 OMR Each (In a Pack of 5) (ex VAT)
19.635 OMR
3.927 OMR Each (In a Pack of 5) (inc. VAT)
Stock information temporarily unavailable.
5
Stock information temporarily unavailable.
Quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | 3.740 OMR | 18.700 OMR |
125 - 370 | 3.388 OMR | 16.940 OMR |
375 - 995 | 3.069 OMR | 15.345 OMR |
1000 - 1995 | 2.744 OMR | 13.722 OMR |
2000+ | 2.596 OMR | 12.980 OMR |
Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
10 Pin Female SOP
End 2
10 Pin Male DIP
End 1 Number of Contacts
10
End 2 Number of Contacts
10
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.