Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
8 Pin Female SOP
End 2
8 Pin Male DIP
End 1 Number of Contacts
8
End 2 Number of Contacts
8
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
19.882 OMR
3.976 OMR Each (In a Pack of 5) (ex VAT)
20.876 OMR
4.175 OMR Each (In a Pack of 5) (inc. VAT)
5
19.882 OMR
3.976 OMR Each (In a Pack of 5) (ex VAT)
20.876 OMR
4.175 OMR Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | 3.976 OMR | 19.882 OMR |
125 - 370 | 3.580 OMR | 17.902 OMR |
375 - 995 | 3.179 OMR | 15.895 OMR |
1000 - 1995 | 2.783 OMR | 13.915 OMR |
2000+ | 2.624 OMR | 13.118 OMR |
Technical Document
Specifications
Brand
WinslowPitch
0.5 mm, 2.54 mm
End 1
8 Pin Female SOP
End 2
8 Pin Male DIP
End 1 Number of Contacts
8
End 2 Number of Contacts
8
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.