Heatsink, 20.3°C/W, 11 x 22 x 24mm, PCB Through Hole

RS Stock No.: 712-4285Brand: AAVID THERMALLOYManufacturers Part No.: PF758G
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Technical Document

Specifications

Brand

AAVID THERMALLOY

Length

11mm

Width

22mm

Height

24mm

Dimensions

11 x 22 x 24mm

Thermal Resistance

20.3°C/W

Mounting

PCB Through Hole

Package Type

TO-220

Product details

TO220 Slip-on 20.3°C/W with Tabs

Slip-on heatsink is tin plated and has integrated tabs for soldering to the PC board
Locating features provide simple device alignment and spring action holds the device for good thermal contact

Stock information temporarily unavailable.

Please check again later.

Stock information temporarily unavailable.

0.960 OMR

Each (In a Pack of 5) (ex VAT)

1.008 OMR

Each (In a Pack of 5) (inc VAT)

Heatsink, 20.3°C/W, 11 x 22 x 24mm, PCB Through Hole

5

Available in multiples of 5
54.800 OMR
109.600 OMR
1514.400 OMR
2019.200 OMR
2524.000 OMR
3028.800 OMR
3533.600 OMR
4038.400 OMR
4543.200 OMR
5044.750 OMR
5549.225 OMR
6053.700 OMR
6558.175 OMR
7062.650 OMR
7567.125 OMR

0.960 OMR

Each (In a Pack of 5) (ex VAT)

1.008 OMR

Each (In a Pack of 5) (inc VAT)

Heatsink, 20.3°C/W, 11 x 22 x 24mm, PCB Through Hole
Stock information temporarily unavailable.

5

Available in multiples of 5
54.800 OMR
109.600 OMR
1514.400 OMR
2019.200 OMR
2524.000 OMR
3028.800 OMR
3533.600 OMR
4038.400 OMR
4543.200 OMR
5044.750 OMR
5549.225 OMR
6053.700 OMR
6558.175 OMR
7062.650 OMR
7567.125 OMR

Buy in bulk

quantityUnit pricePer Pack
5 - 450.960 OMR4.800 OMR
50 - 1200.895 OMR4.475 OMR
125 - 2450.865 OMR4.325 OMR
250 - 4950.855 OMR4.275 OMR
500+0.800 OMR4.000 OMR

Technical Document

Specifications

Brand

AAVID THERMALLOY

Length

11mm

Width

22mm

Height

24mm

Dimensions

11 x 22 x 24mm

Thermal Resistance

20.3°C/W

Mounting

PCB Through Hole

Package Type

TO-220

Product details

TO220 Slip-on 20.3°C/W with Tabs

Slip-on heatsink is tin plated and has integrated tabs for soldering to the PC board
Locating features provide simple device alignment and spring action holds the device for good thermal contact