Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
RF Transceiver
Technology
IPD on Non-Conductive Glass Substrate
Sub Type
RF Transceiver
Package Type
Bumpless CSP
Pin Count
6
Mount Type
Surface
Operating Band 1 Frequency
2500MHz
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
105°C
Length
1.63mm
Standards/Approvals
ECOPACK2
Series
MLPF-WB55
Number of Operating Bands
1
Automotive Standard
No
Country of Origin
China
Product Details
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
Stock information temporarily unavailable.
3.438 OMR
0.138 OMR Each (In a Pack of 25) (ex VAT)
3.610 OMR
0.145 OMR Each (In a Pack of 25) (inc. VAT)
Standard
25
3.438 OMR
0.138 OMR Each (In a Pack of 25) (ex VAT)
3.610 OMR
0.145 OMR Each (In a Pack of 25) (inc. VAT)
Stock information temporarily unavailable.
Standard
25
| Quantity | Unit price | Per Pack |
|---|---|---|
| 25 - 75 | 0.138 OMR | 3.438 OMR |
| 100 - 225 | 0.126 OMR | 3.140 OMR |
| 250 - 475 | 0.120 OMR | 2.990 OMR |
| 500 - 975 | 0.114 OMR | 2.840 OMR |
| 1000+ | 0.108 OMR | 2.691 OMR |
Technical Documents
Specifications
Brand
STMicroelectronicsProduct Type
RF Transceiver
Technology
IPD on Non-Conductive Glass Substrate
Sub Type
RF Transceiver
Package Type
Bumpless CSP
Pin Count
6
Mount Type
Surface
Operating Band 1 Frequency
2500MHz
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
105°C
Length
1.63mm
Standards/Approvals
ECOPACK2
Series
MLPF-WB55
Number of Operating Bands
1
Automotive Standard
No
Country of Origin
China
Product Details
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.