Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
17.378 OMR
1.738 OMR Each (In a Pack of 10) (ex VAT)
18.247 OMR
1.825 OMR Each (In a Pack of 10) (inc. VAT)
10
17.378 OMR
1.738 OMR Each (In a Pack of 10) (ex VAT)
18.247 OMR
1.825 OMR Each (In a Pack of 10) (inc. VAT)
10
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| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 1.738 OMR | 17.378 OMR |
| 50 - 240 | 1.570 OMR | 15.698 OMR |
| 250 - 490 | 1.402 OMR | 14.018 OMR |
| 500 - 990 | 1.239 OMR | 12.390 OMR |
| 1000+ | 1.087 OMR | 10.868 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor