Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
8.195 OMR
0.820 OMR Each (In a Pack of 10) (ex VAT)
8.605 OMR
0.861 OMR Each (In a Pack of 10) (inc. VAT)
10
8.195 OMR
0.820 OMR Each (In a Pack of 10) (ex VAT)
8.605 OMR
0.861 OMR Each (In a Pack of 10) (inc. VAT)
10
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| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 0.820 OMR | 8.195 OMR |
| 50 - 240 | 0.742 OMR | 7.425 OMR |
| 250 - 490 | 0.660 OMR | 6.600 OMR |
| 500 - 990 | 0.605 OMR | 6.050 OMR |
| 1000+ | 0.583 OMR | 5.830 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor