Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
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0.665 OMR
Each (In a Pack of 10) (ex VAT)
0.698 OMR
Each (In a Pack of 10) (inc VAT)
10
0.665 OMR
Each (In a Pack of 10) (ex VAT)
0.698 OMR
Each (In a Pack of 10) (inc VAT)
10
Buy in bulk
| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 0.665 OMR | 6.650 OMR |
| 50 - 240 | 0.600 OMR | 6.000 OMR |
| 250 - 490 | 0.535 OMR | 5.350 OMR |
| 500 - 990 | 0.490 OMR | 4.900 OMR |
| 1000+ | 0.470 OMR | 4.700 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor