Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
18.205 OMR
1.820 OMR Each (In a Pack of 10) (ex VAT)
19.115 OMR
1.911 OMR Each (In a Pack of 10) (inc. VAT)
10
18.205 OMR
1.820 OMR Each (In a Pack of 10) (ex VAT)
19.115 OMR
1.911 OMR Each (In a Pack of 10) (inc. VAT)
10
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| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 1.820 OMR | 18.205 OMR |
| 50 - 240 | 1.644 OMR | 16.445 OMR |
| 250 - 490 | 1.468 OMR | 14.685 OMR |
| 500 - 990 | 1.298 OMR | 12.980 OMR |
| 1000+ | 1.138 OMR | 11.385 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor