Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
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16.550 OMR
1.655 OMR Each (In a Pack of 10) (ex VAT)
17.378 OMR
1.738 OMR Each (In a Pack of 10) (inc. VAT)
10
16.550 OMR
1.655 OMR Each (In a Pack of 10) (ex VAT)
17.378 OMR
1.738 OMR Each (In a Pack of 10) (inc. VAT)
10
Buy in bulk
| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 1.655 OMR | 16.550 OMR |
| 50 - 240 | 1.495 OMR | 14.950 OMR |
| 250 - 490 | 1.340 OMR | 13.400 OMR |
| 500 - 990 | 1.195 OMR | 11.950 OMR |
| 1000+ | 1.045 OMR | 10.450 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor