Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
18.755 OMR
1.876 OMR Each (In a Pack of 10) (ex VAT)
19.693 OMR
1.970 OMR Each (In a Pack of 10) (inc. VAT)
10
18.755 OMR
1.876 OMR Each (In a Pack of 10) (ex VAT)
19.693 OMR
1.970 OMR Each (In a Pack of 10) (inc. VAT)
10
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Quantity | Unit price | Per Pack |
---|---|---|
10 - 40 | 1.876 OMR | 18.755 OMR |
50 - 240 | 1.688 OMR | 16.885 OMR |
250 - 490 | 1.512 OMR | 15.125 OMR |
500 - 990 | 1.336 OMR | 13.365 OMR |
1000+ | 1.172 OMR | 11.715 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor