Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
7.975 OMR
0.798 OMR Each (In a Pack of 10) (ex VAT)
8.374 OMR
0.838 OMR Each (In a Pack of 10) (inc. VAT)
10
7.975 OMR
0.798 OMR Each (In a Pack of 10) (ex VAT)
8.374 OMR
0.838 OMR Each (In a Pack of 10) (inc. VAT)
10
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| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 0.798 OMR | 7.975 OMR |
| 50 - 240 | 0.720 OMR | 7.205 OMR |
| 250 - 490 | 0.644 OMR | 6.435 OMR |
| 500 - 990 | 0.588 OMR | 5.885 OMR |
| 1000+ | 0.566 OMR | 5.665 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor