Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
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1.520 OMR
Each (In a Pack of 10) (ex VAT)
1.596 OMR
Each (In a Pack of 10) (inc VAT)
10
1.520 OMR
Each (In a Pack of 10) (ex VAT)
1.596 OMR
Each (In a Pack of 10) (inc VAT)
10
Buy in bulk
| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 1.520 OMR | 15.200 OMR |
| 50 - 240 | 1.370 OMR | 13.700 OMR |
| 250 - 490 | 1.225 OMR | 12.250 OMR |
| 500 - 990 | 1.075 OMR | 10.750 OMR |
| 1000+ | 0.940 OMR | 9.400 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor