Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
7.612 OMR
0.761 OMR Each (In a Pack of 10) (ex VAT)
7.993 OMR
0.799 OMR Each (In a Pack of 10) (inc. VAT)
10
7.612 OMR
0.761 OMR Each (In a Pack of 10) (ex VAT)
7.993 OMR
0.799 OMR Each (In a Pack of 10) (inc. VAT)
10
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| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 0.761 OMR | 7.612 OMR |
| 50 - 240 | 0.688 OMR | 6.878 OMR |
| 250 - 490 | 0.614 OMR | 6.142 OMR |
| 500 - 990 | 0.562 OMR | 5.618 OMR |
| 1000+ | 0.541 OMR | 5.408 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor