Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
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0.725 OMR
Each (In a Pack of 10) (ex VAT)
0.761 OMR
Each (In a Pack of 10) (inc. VAT)
10
0.725 OMR
Each (In a Pack of 10) (ex VAT)
0.761 OMR
Each (In a Pack of 10) (inc. VAT)
10
Buy in bulk
| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 0.725 OMR | 7.250 OMR |
| 50 - 240 | 0.655 OMR | 6.550 OMR |
| 250 - 490 | 0.585 OMR | 5.850 OMR |
| 500 - 990 | 0.540 OMR | 5.400 OMR |
| 1000+ | 0.525 OMR | 5.250 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor