Chemtronics 1.5 m, Width 0.8 mm
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
15.219 OMR
15.219 OMR Each (ex VAT)
15.980 OMR
15.980 OMR Each (inc. VAT)
1
15.219 OMR
15.219 OMR Each (ex VAT)
15.980 OMR
15.980 OMR Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 4 | 15.219 OMR |
| 5 - 9 | 14.610 OMR |
| 10 - 39 | 13.972 OMR |
| 40+ | 12.975 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid