Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
19.866 OMR
19.866 OMR 1 Bag of 10 (ex VAT)
20.859 OMR
20.859 OMR 1 Bag of 10 (inc. VAT)
1
19.866 OMR
19.866 OMR 1 Bag of 10 (ex VAT)
20.859 OMR
20.859 OMR 1 Bag of 10 (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | 19.866 OMR |
| 10 - 19 | 19.064 OMR |
| 20 - 49 | 18.472 OMR |
| 50+ | 17.187 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
