Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
18.612 OMR
18.612 OMR 1 Bag of 10 (ex VAT)
19.543 OMR
19.543 OMR 1 Bag of 10 (inc. VAT)
1
18.612 OMR
18.612 OMR 1 Bag of 10 (ex VAT)
19.543 OMR
19.543 OMR 1 Bag of 10 (inc. VAT)
1
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | 
|---|---|
| 1 - 9 | 18.612 OMR | 
| 10 - 19 | 17.858 OMR | 
| 20 - 49 | 17.303 OMR | 
| 50+ | 16.060 OMR | 
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
