Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
14.432 OMR
14.432 OMR Each (ex VAT)
15.154 OMR
15.154 OMR Each (inc. VAT)
1
14.432 OMR
14.432 OMR Each (ex VAT)
15.154 OMR
15.154 OMR Each (inc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
| Quantity | Unit price | 
|---|---|
| 1 - 4 | 14.432 OMR | 
| 5 - 9 | 13.854 OMR | 
| 10 - 39 | 13.162 OMR | 
| 40+ | 12.221 OMR | 
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
