Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Brand
BergquistAccessory Type
Adhesive Tape
For Use With
Heatsink
Distrelec Product Id
30422505
Country of Origin
United States
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
8.741 OMR
8.741 OMR Each (ex VAT)
9.178 OMR
9.178 OMR Each (inc. VAT)
1
8.741 OMR
8.741 OMR Each (ex VAT)
9.178 OMR
9.178 OMR Each (inc. VAT)
1
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Please check again later.
| quantity | Unit price |
|---|---|
| 1 - 9 | 8.741 OMR |
| 10 - 49 | 7.891 OMR |
| 50+ | 7.124 OMR |
Technical Document
Specifications
Brand
BergquistAccessory Type
Adhesive Tape
For Use With
Heatsink
Distrelec Product Id
30422505
Country of Origin
United States
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor