Bergquist Heatsink Adhesive Tape for use with Heatsink
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Stock information temporarily unavailable.
Please check again later.
0.680 OMR
Each (In a Pack of 10) (ex VAT)
0.714 OMR
Each (In a Pack of 10) (inc VAT)
10
0.680 OMR
Each (In a Pack of 10) (ex VAT)
0.714 OMR
Each (In a Pack of 10) (inc VAT)
10
Buy in bulk
| quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 40 | 0.680 OMR | 6.800 OMR |
| 50 - 240 | 0.615 OMR | 6.150 OMR |
| 250 - 490 | 0.545 OMR | 5.450 OMR |
| 500 - 990 | 0.500 OMR | 5.000 OMR |
| 1000+ | 0.480 OMR | 4.800 OMR |
Technical Document
Specifications
Product details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor